Archon SB-E

Armor style heatsink fin array, with mirrored copper base, elevates heatsinks overall quality.

Optimized for high TDP of Next generation Intel Sandy Bridge-E (LGA2011) sockets.

Large heatsink fin array provides dissipating area of up to 150*125mm, making complete use of the airflow, with 150mm 140mm or 120mm fan.

With the max width of 55mm (heatsink only), tall memory heat spreaders are avoided.

Eight 6mm sintered heatpipe design, all heatpipes are nickel plated, to slow the oxidation deterioration to the heatpipe, to ensure longer usage and performance of the heatsink for the CPU.

Universal bracket system, allow users to mount to both Intel and AMD platforms

Includes one Thermalright TY-150 PWM fan, Ultra low noise at 23 dBA at max rpm (50cm testing distance)

The Archon package includes a tube of CF III Thermal paste, to provide the best combination for use with Archon.

Intel: Socket LGA 775/1150/1151/1155/1156/1366/2011/2011-3

AMD: Socket AM2/AM2+/AM3/AM3+/FM1/FM2

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产品介绍

Heatsink Specifications:

Dimension: L155 mm x W53.6 mm x H170.2 mm

Weight: 750g

Heat pipes: Eight 6mm Copper Heatpipes

Fin: T = 0.5 mm ; Gap = 1.9 mm

Fin Pcs: 28 + 6 + 5 = 39 pcs

Copper Base: C1100 Pure Copper Mirror Finished base with Nickel Plating

Motherboard to Fin: 27 + 8 = 35 mm

TY-150 FAN Spec

Dimension: L170 mm x W153 mm x H25.5 mm

Rated Speed: 500 – 1100 rpm

Weight: 180g

Noise Level: 22 – 34 dB(A)

Air Flow: 38.2 – 84.2 CFM Click to enlarge

Thermal design power: 320watt

Silent PC Review
2012.06.18
EN

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