[:en]Thermalright’s All Heatsinks upgrade new package with LGA1151 Spacer solves Intel Skylake[:tw]Thermalright的散熱器升級新包裝內含CPU加強LGA1151解決英特爾Skylake問題[:cn]Thermalright的散热器升级新包装内含CPU加强LGA1151解决英特尔Skylake问题

[:en]

Thermalright’s All Heatsinks upgrade new package with LGA1151 Spacer solves Intel Skylake
Thermalright’s all series of Heatsinks upgrade new package of the accessory which include the LGA1151 Spacer. That could proprietary support plate for Intel Skylake processors.

After seeing the photos and reports of Skylake PCB deformation on internet, Thermalright decided to address the issue. It appears the LGA1151 may have some potential problems dealing with the mounting pressure and / or weight of heavier aftermarket coolers (over 500g as specified in Intel LGA1150 socket Application Guide). In our endeavour for excellence Thermalright is trying to lower the possibility of this happening by developing a spacer to fill the open area between the load plate and PCB to hold it tightly in place. The spacer fits onto CPU with a 0.5mm raised surface around the IHS fitting snugly on CPU PCB when load plate is latched down.

As you can see the spacer has a 0.7mm taper from back to front with a 0.5mm raised area where it fits around the IHS. The taper matches the slope of the socket load plate. Thick edge of taper goes toward load plate hinge. When the load plate is latched and presses on mounting points of IHS, it also presses on Thermalright 1151 spacer. This holds the CPU PCB firmly in plate. Making it harder for it to deform and cause problems.

Thermalright LGA1151 Support Spacers will be available free of charge at most of Thermalright resellers by March 15th, 2016 for users buying a Thermalright cooler. Please consult with our resellers for availability before you place an order. If you already have a Thermalright cooler and are moving it to Skylake CPU, just show your Skylake proof of purchase to one of our retailers. Of course if this is done online, you will have to pay the postage costs.

[:tw]

Thermalright所有系列的散熱器升級新包裝,其中包括了LGA1151加強墊片配件。英特爾SKYLAKE微架構處理器專用的支撐板。

看到照片和互聯網上SKYLAKE微架構PCB變形的報告後,Thermalright著手解決這一問題。LGA1151可改善冷卻器的重量壓力和/或處理的(超過500克英特爾LGA1150插座應用指南)一些潛在的問題。在我們的卓越努力下Thermalright正試開發一個墊片,以填補承載板和PCB之間的地帶,緊緊到位握住它來降低這種情況發生的可能性。間隔適合與CPU負載時板被鎖住IHS0.5mm的凸起表面緊貼CPU配合PCB上。

正如圖面所看到的隔板具有從後到前用它卡在IHS0.5mm至凸起區域0.7毫米。插座承載板的斜率匹配。錐形的厚邊朝那張承載板鉸鏈。當負載板被鎖存和IHS的安裝,它也壓在1151Thermalright加強板。牢牢佔據CPU PCB板中並強固防止因重量變形而引起的問題。

2016年3月15日起,Thermalright LGA1151加強支持將免費提供,為用戶購買的Thermalright冷卻器。可以經由Thermalright經銷商索取。您下訂單之前,請與我們的經銷商諮詢。如果您已經有一個Thermalright的散熱器,並且將其移動到SKYLAKE微架構CPU,顯示購買單以證明我們的零售商之一。當然,如果是在網路上完成的,您將支付郵資。

[:cn]

Thermalright所有系列的散热器升级新包装,其中包括了LGA1151加强垫片配件。英特尔SKYLAKE微架构处理器专用的支撑板。

看到照片和互联网上SKYLAKE微架构PCB变形的报告后,Thermalright着手解决这一问题。LGA1151可改善冷却器的重量压力和/或处理的(超过500克英特尔LGA1150插座应用指南)一些潜在的问题。在我们的卓越努力下Thermalright正试开发一个垫片,以填补附加电路板和PCB之间的地带,紧紧到位握住它来降低这种情况发生的可能性。间隔适合与CPU负载时板被锁住IHS0.5mm的凸起表面紧贴CPU配合PCB上。

正如图面所看到的隔板具有从后到前用它卡在IHS0.5mm至凸起区域0.7毫米。插座附加电路板的斜率匹配。锥形的厚边朝那张附加电路板铰链。当负载板被锁存和IHS的安装,它也压在1151Thermalright加强板。牢牢占据CPU PCB板中并强固防止因重量变形而引起的问题。

2016年3月15日起,Thermalright LGA1151加强支持将免费提供,为用户购买的Thermalright冷却器。可以经由Thermalright经销商索取。您下订单之前,请与我们的经销商咨询。如果您已经有一个Thermalright的散热器,并且将其移动到SKYLAKE微架构CPU,显示购买单以证明我们的零售商之一。当然,如果是在网络上完成的,您将支付邮资。